DRAM 内存
奔馳科技提供完整 DDR2 至 HBM3E 世代的 DRAM 記憶體解決方案，涵蓋商業級、工業級及寬溫規格，並持續推進 DDR5 / LPDDR5 / HBM3E 的樣品試產與量產導入。
料號
規格
封裝/電壓
RT-D2-256M16800C84BA
RT-D2-256M16800C84BB
DDR2-800 / 16M × 16 (256Mb)
84-Ball BGA
Commercial Grade: 0℃ ~ 95℃
84-Ball BGA
1.8V
RT-D2-256M161066C84BA
RT-D2-256M161066C84BB
DDR2-1066 / 16M × 16 (256Mb)
84-Ball BGA
Commercial Grade: 0℃ ~ 95℃
84-Ball BGA
1.8V
RT-D2-256M16800I84BA
RT-D2-256M16800I84BB
DDR2-800 / 16M × 16 (256Mb)
84-Ball BGA
Industrial Grade: -40℃ ~ 95℃
84-Ball BGA
1.8V
RT-D2-512M16800C84BA
RT-D2-512M16800C84BB
DDR2-400 / 32M × 16 (512Mb)
84-Ball BGA
Commercial Grade: 0℃ ~ 95℃
84-Ball BGA
1.8V
RT-D3-L1G161866C96BA
RT-D3-L1G161866C96BB
DDR3L-1866 / 64M × 16 (1Gb)
933 Mbps
96-Ball BGA
Commercial Grade: 0℃ ~ 95℃
96-Ball BGA
1.35V
RT-D41024M83200C78BA
RT-D41024M83200C78BB
DDR4-3200 / 1024M x 8 (8Gb)
CL 22-22-22 @ 1600 MHz
78-Ball TFBGA, 7.50 x 12.00 mm
Commercial Grade: 0℃ ~ 95℃
78-Ball TFBGA
1.2V / 1.2V / 2.5V
RT-D41024M82666C78BA
RT-D41024M82666C78BB
DDR4-2666 / 1024M x 8 (8Gb)
CL 19-19-19 @ 1333 MHz
78-Ball TFBGA, 7.50 x 12.00 mm
Commercial / Industrial / Wide Temp
78-Ball TFBGA
1.2V / 1.2V / 2.5V
RT-D4512M83200C78BA
RT-D4512M83200C78BB
DDR4-3200 / 512M x 8 (4Gb)
CL 22-22-22 @ 1600 MHz
78-Ball TFBGA, 7.50 x 12.00 mm
Commercial Grade: 0℃ ~ 95℃
78-Ball TFBGA
1.2V / 1.2V / 2.5V
RT-D4512M82666C78BA
RT-D4512M82666C78BB
DDR4-2666 / 512M x 8 (4Gb)
CL 19-19-19 @ 1333 MHz
78-Ball TFBGA, 7.50 x 12.00 mm
Commercial / Industrial / Wide Temp
78-Ball TFBGA
1.2V / 1.2V / 2.5V
•8n Prefetch — JEDEC DDR4
•Post Package Repair (PPR)
•Fine Granularity Refresh (FGR)
•ZQ Calibration 240Ω ± 1%
•CK/CK̄ · DQS/DQS̄
•Command / Address Parity
•Auto Self Refresh (ASR)
•Ball pitch 0.80 mm · RoHS / Halogen-Free