Advanced Packaging Racer Pin™

Racer Pin™ is RACER TECH's proprietary high-density copper pillar insertion packaging technology. Using pre-formed cold-forged oxygen-free copper (OFC) pillars with a minimum diameter of φ60 µm, thousands of pillars are simultaneously inserted via a proprietary mass-transfer fixture with ±5 µm placement accuracy and pitch control down to 10 µm. After EMC epoxy fill and mechanical planarization, copper/epoxy co-planarity is better than 5 µm; pillar height is adjustable from 300 to 2,400 µm for maximum design flexibility.

In HBM3E probe array applications, Racer Pin™ achieves over 12,726 copper pins within a single HBM3E die footprint (7.08 × 8.83 mm) — 1.64× the HBM3E microbump count (7,775) — providing full test-point coverage with alignment redundancy. Compared to mainstream MEMS probe cards that rely on semiconductor lithography, Racer Pin™ requires no cleanroom equipment, reducing manufacturing cost by 30–50% and cutting sample lead time from 8–12 weeks to just 2–4 weeks.

Cold-forged OFC solid copper pillars inherently outperform electroformed tungsten thin-film probes in conductivity, mechanical durability, and thermal performance, withstanding more contact cycles. The modular insertion design also enables localized repair — individual damaged pillars can be replaced independently, unlike MEMS probe cards where an entire sheet must be scrapped. Based in Hsinchu, Taiwan, RACER TECH integrates a complete semiconductor packaging supply chain with a dual-source copper pillar strategy (primary: FINECS Japan; backup: MW Components USA), delivering one-stop advanced packaging interconnect solutions from PoC samples to mass production.